A　novel　flow　arrangement　of　staggered　flow　(the　fluid　staggers　flow　along　each　layer)　is　presented　to　remove　higher　heat　flux　and　obtain　more　uniform　bottom　temperature　in　double-layered　microchannel　heat　sinks.　Compared　to　the　counter　flow,　the　heat　transfer　performance　of　two　types　of　staggered　flow　is　studied　numerically.　The　distribution　of　the　total　temperature,　average　bottom　temperature,　maximum　temperature　difference　and　thermal　resistance　is　presented　for　different　flow　arrangements　under　similar　pumping　power.　The　results　show　that　the　flow　arrangement　with　staggered　flow　2　(the　fluid　flows　along　the　x　direction　at　the　second　layer,　while　fluid　staggers　along　they　direction　at　the　first　layer)　provides　the　lowest　maximum　and　most　uniform　temperature　under　similar　working　condition.　Moreover,　the　thermal　resistance　of　staggered　flow　2　is　much　lower　than　that　of　counter　flow　and　staggered　flow　1　under　the　similar　pumping　power,　which　indicates　that　it　has　better　cooling　capacity　for　microelectronic　cooling.　(C)　2016　Elsevier　Ltd.　All　rights　reserved.