In　this　work,　the　W-(Ni)-Cu　composites　were　fabricated　by　Selective　Laser　Melting　with　the　different　W　content　up　to　80　wt.%.　The　effects　of　relative　density,　microstructure　on　thermal　conductivity,　thermal　expansion　coefficient,　roughness　and　hardness　of　W-(Ni)-Cu　composites　were　evaluated.　The　results　indicate　that　during　SLM　W-(Ni)-Cu　composites,　there　are　two　kinds　of　densification　mechanism　reflected　on　the　microstructure　characteristic.　Rearrangement　densification　favors　to　achieve　higher　relative　density,　dense　compact　Cu　matrix　and　a　homogeneous　distribution　of　W　solids,　the　thermal　conductivity　closer　to　theoretical　value.　Solid-state　sintering　densification　obtains　porous　Cu　matrix　with　W-W　contiguity　and　the　phenomenon　is　severer　with　the　increase　of　W　content,　the　thermal　conduction　structure　is　in　good　agreement　with　Randall＇s　model.　Ni　additive　is　beneficial　to　densify　the　Cu　matrix.　The　obtained　coefficient　of　thermal　expansion　(CTE)　through　two　kinds　of　densification　mechanism　are　both　lower　than　the　theoretical　value.　The　results　show　that　the　thermal　conductivity　and　CTE　increase　with　the　Cu　content,　while　the　relative　density　trends　on　the　contrary.　The　surface　morphology　presents　easy　to　balling　due　to　the　instinct　property　of　W　and　Cu.　The　roughness　and　hardness　also　increase　with　the　increase　of　W　content.　(C)　2016　Elsevier　Ltd.　All　rights　reserved.