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Author:

刘同辉 (刘同辉.) | 文胜平 (文胜平.) | 李健飞 (李健飞.) | 陈子勇 (陈子勇.) (Scholars:陈子勇) | 聂祚仁 (聂祚仁.) (Scholars:聂祚仁)

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CQVIP PKU CSCD

Abstract:

采用硬度和电导率等测试,结合透射电镜微观组织观察,研究了退火工艺对Al-Er-Cu合金电导率和硬度的影响。结果表明:冷轧后等时退火到200~300℃之间,或者200℃等温退火24 h到48 h之间,Al-Er-Cu合金同时具有较高的硬度和电导率。Al-Er-Cu合金冷轧后退火过程中Al_3Er相的析出提高了合金轧态组织的热稳定性,使其硬度能够在退火过程中减少下降;而Al_2Cu相的析出使合金的电导率显著升高。

Keyword:

微合金化 电导率 退火 铝合金

Author Community:

  • [ 1 ] 北京工业大学材料学院

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Source :

材料热处理学报

Year: 2017

Issue: 06

Volume: 38

Page: 31-35

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 15

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