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Author:

Zhang, L-H. (Zhang, L-H..) | Shang, D-G. (Shang, D-G..) (Scholars:尚德广) | Liu, X-D. (Liu, X-D..) | Sun, Y-J. (Sun, Y-J..) | Guo, Y-B. (Guo, Y-B..) | Liu, F-Z. (Liu, F-Z..) | Chen, T. (Chen, T..)

Indexed by:

EI Scopus SCIE

Abstract:

The healing variable and enhancement variable were first defined by the fatigue ductility, and then based on the relationship of the damage variable, the healing variable and the enhancement variable, a nonlinear fatigue damage-healing model was proposed for predicting the fatigue life of the healed copper film by laser shock peening (LSP). The nonlinear fatigue damage cumulative process was considered in the model for the original specimen without LSP under constant and variable amplitude loadings. The results showed that the proposed nonlinear fatigue damage-healing model can predict the residual fatigue life for the damaged copper film specimen well.

Keyword:

fatigue ductility healing variable nonlinear fatigue damage life prediction enhancement variable

Author Community:

  • [ 1 ] [Zhang, L-H.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Shang, D-G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Liu, X-D.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Sun, Y-J.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Guo, Y-B.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 6 ] [Liu, F-Z.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 7 ] [Chen, T.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 尚德广

    [Shang, D-G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES

ISSN: 8756-758X

Year: 2014

Issue: 11

Volume: 37

Page: 1232-1241

3 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 2

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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