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Author:

张丽云 (张丽云.) | 肖征荣 (肖征荣.) | 秦琳 (秦琳.)

Indexed by:

CQVIP

Abstract:

随着LTE产业的发展,国内外芯片厂商都在研发LTE芯片产品。从多频多模技术、功耗和终端芯片工艺的要求这三方面分析了LTE终端芯片的关键技术,并介绍了高通、联发科、展讯、美满电子、英特尔等几个主要研发和生产LTE芯片的国内外厂商当前比较有代表性的芯片,最后还展望了LTE芯片的发展趋势以及面临的挑战。

Keyword:

多频多模 LTE 终端芯片

Author Community:

  • [ 1 ] 中国联通研究院
  • [ 2 ] 北京工业大学

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Source :

移动通信

Year: 2013

Issue: 23

Volume: 37

Page: 60-62

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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