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Abstract:
研究了Cu含量对SnAgCu系钎料合金显微组织及其与化学镀Ni基板钎焊接头力学性能的影响.结果表明:高Cu含量SnAgCu合金会产生较多的(CuxNi1-x)6Sn5金属间化合物,从而减少镀Ni层的消耗,进一步提高钎焊接头的剪切强度.与Sn-3.0Ag-0.3Cu相比,Sn-3.0Ag-1.0Cu钎焊接头剪切强度提高了6.78%.经过150 ℃时效1 000 h后,界面Ni3(P, Sn)层的增长率从Sn-3.0Ag-0.3Cu合金的约66%降低到Sn-3.0Ag-1.0Cu合金的约40%.
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电子元件与材料
ISSN: 1001-2028
Year: 2009
Issue: 5
Volume: 28
Page: 39-42
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: 8
Chinese Cited Count:
30 Days PV: 4
Affiliated Colleges: