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Author:

申灏 (申灏.) | 邰枫 (邰枫.) | 郭福 (郭福.) (Scholars:郭福) | 史耀武 (史耀武.)

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CQVIP PKU CSCD

Abstract:

研究了Cu含量对SnAgCu系钎料合金显微组织及其与化学镀Ni基板钎焊接头力学性能的影响.结果表明:高Cu含量SnAgCu合金会产生较多的(CuxNi1-x)6Sn5金属间化合物,从而减少镀Ni层的消耗,进一步提高钎焊接头的剪切强度.与Sn-3.0Ag-0.3Cu相比,Sn-3.0Ag-1.0Cu钎焊接头剪切强度提高了6.78%.经过150 ℃时效1 000 h后,界面Ni3(P, Sn)层的增长率从Sn-3.0Ag-0.3Cu合金的约66%降低到Sn-3.0Ag-1.0Cu合金的约40%.

Keyword:

力学性能 金属间化合物 SnAgCu钎料合金

Author Community:

  • [ 1 ] [申灏]北京工业大学
  • [ 2 ] [邰枫]北京工业大学
  • [ 3 ] [郭福]北京工业大学
  • [ 4 ] [史耀武]北京工业大学

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Source :

电子元件与材料

ISSN: 1001-2028

Year: 2009

Issue: 5

Volume: 28

Page: 39-42

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 8

Chinese Cited Count:

30 Days PV: 4

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