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Author:

杨庆生 (杨庆生.) (Scholars:杨庆生) | 刘健 (刘健.)

Indexed by:

CQVIP PKU CSCD

Abstract:

介绍了智能材料和智能复合材料的基本概念、主要类型以及智能材料的感知与驱动机理,重点介绍了智能复合材料当前的应用情况,并简要阐述了智能复合材料领域当前研究的热点问题,介绍了该领域中的多物理场耦合问题及CNT/SMP复合材料性能的研究现状,展望了智能复合材料的发展前景.

Keyword:

智能材料 多物理耦合 智能复合材料

Author Community:

  • [ 1 ] 北京工业大学机电学院

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Source :

力学与实践

Year: 2008

Issue: 06

Page: 11-17

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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