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Abstract：
Whiskers were observed on both the anodic and cathodic Cu substrate with current density of 3x10(3) A/cm(2) at 100 degrees C in Cu/eutectic SnBi/Cu solder joint. EDX compositional analyses indicate that these whiskers were composed of Sn and Bi. After polishing, plenty of Cu6Sn5 intermetallic compounds were found on the Cu substrate surface. Experimental results show that with stressing time increasing, SnBi solder started to diffuse and migrate towards the Cu substrate by electromigration force, which formed a thin film layer on the Cu substrate. With the dual effect of Joule heating and circumstance temperature, Sn reacted with Cu to form Cu6Sn5 intermetallic compounds resulting in compressive stress formation in the thin film layer. To relieve the compressive stress, Sn-Bi whiskers were extruded out.
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RARE METAL MATERIALS AND ENGINEERING
ISSN： 1002-185X
Year： 2010
Volume： 39
Page： 200-203
0 . 7 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
JCR Journal Grade：4
CAS Journal Grade：4
Cited Count：
WoS CC Cited Count： 2
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 5
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