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Abstract:
采用自主研制的1000 W半导体激光器,对2024和7075铝合金薄板进行了焊接.论文分析了不同工艺参数对于铝合金焊缝宏观成型和微观组织的影响.2024铝合金焊缝的沉淀析出物尺寸明显变小.试验研究表明焊接过程比较稳定,焊缝成型良好,得出大功率半导体激光器适合于薄铝板的焊接.
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Source :
红外与激光工程
ISSN: 1007-2276
Year: 2007
Issue: z1
Volume: 36
Page: 326-328
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: 11
Chinese Cited Count:
30 Days PV: 4
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