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Author:

史耀武 (史耀武.) | 夏志东 (夏志东.)

Indexed by:

CQVIP

Keyword:

无铅钎料 表面组装技术 电子组装 钎料膏

Author Community:

  • [ 1 ] [史耀武]北京工业大学
  • [ 2 ] [夏志东]北京工业大学

Reprint Author's Address:

Email:

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Source :

印制电路与贴装

ISSN: 1680-5313

Year: 2001

Issue: 009

Volume: 000

Page: 13-17

Cited Count:

WoS CC Cited Count: 36

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 8

Affiliated Colleges:

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