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Author:

Yang, Yu'e (Yang, Yu'e.) | He, Cunfu (He, Cunfu.) (Scholars:何存富) | Wu, Bin (Wu, Bin.)

Indexed by:

CPCI-S EI Scopus

Abstract:

Microwaves penetrate inside of low loss dielectric materials and they are sensitive to the presence of internal interfaces and non-uniformities. This allows microwave nondestructive inspection techniques to be utilized for inspecting dielectric in metallic substrate. This article simulated Microwave inspecting thickness and delamination in layered-dielectric in metallic substrate, using open-ended rectangular waveguide probe. Effective reflection coefficient of microwave is used in the detection and evaluation to thickness or delimination in the media. This paper optimized the detection frequency and standoff, which provide a reference for the experimental study.

Keyword:

Delamination Frequency Layered-dielectric in metallic substrate Standoff distance Thickness

Author Community:

  • [ 1 ] [Yang, Yu'e]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [He, Cunfu]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Wu, Bin]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 何存富

    [He, Cunfu]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

SUSTAINABLE CONSTRUCTION MATERIALS AND COMPUTER ENGINEERING

ISSN: 1022-6680

Year: 2012

Volume: 346

Page: 764-771

Language: English

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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