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Abstract:
Microwaves penetrate inside of low loss dielectric materials and they are sensitive to the presence of internal interfaces and non-uniformities. This allows microwave nondestructive inspection techniques to be utilized for inspecting dielectric in metallic substrate. This article simulated Microwave inspecting thickness and delamination in layered-dielectric in metallic substrate, using open-ended rectangular waveguide probe. Effective reflection coefficient of microwave is used in the detection and evaluation to thickness or delimination in the media. This paper optimized the detection frequency and standoff, which provide a reference for the experimental study.
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SUSTAINABLE CONSTRUCTION MATERIALS AND COMPUTER ENGINEERING
ISSN: 1022-6680
Year: 2012
Volume: 346
Page: 764-771
Language: English
Cited Count:
WoS CC Cited Count: 5
SCOPUS Cited Count: 6
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 8
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