In　this　study,　based　on　the　conductive　polymer　filled　with　Ag-coated　Cu　dendritic　powder　(ACDP),　Ag-coated　glass　fiber　powder　(AGFP)　was　selected　as　assistant　filler　to　improve　the　conductive　network.　The　results　showed　that　the　volume　resistivity　reached　0.004　Omega.cm　when　the　total　fillers　were　less　than　70.6　wt%.　The　effect　of　the　filler　content　of　the　AGFP　powder　on　the　conductivity,　creep　behavior　of　resistance　and　piezo-resistivity　properties　of　the　conductive　polymer　was　studied.　Under　constant　pressure,　the　resistance　creep　behavior　of　the　conductive　polymer　showed　that　the　volume　resistivity　decreased　nonlinearly　with　time.　When　the　pressure　was　applied　within　0　similar　to　2.0MPa,　the　conductivity　variation　of　the　conductive　polymer　exhibited　a　positive　pressure　coefficient　of　resistance　(PPCR).　However,　the　piezoresistance　effect　could　be　neglected　with　increasing　filler　content　and　applied　pressure.　In　addition,　the　reliability　of　the　conductive　polymer　under　aging　at　85oC　and　85%　relative　humidity　(RH)　in　a　temperature/humidity　chamber　was　discussed.