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Author:

Zhang, Ming (Zhang, Ming.) | Liu, Zhongliang (Liu, Zhongliang.) (Scholars:刘中良) | Ma, Guoyuan (Ma, Guoyuan.) (Scholars:马国远)

Indexed by:

CPCI-S

Abstract:

An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Vapor chamber is one of highly effective thermal spreaders. In this paper, a novel grooved vapor chamber was designed. The grooved structure of the vapor chamber can improve its axial and radial heat transfer and also can form the capillary loop between condensation and evaporation surfaces. A two dimensional heat and mass transfer model for the grooved vapor chamber is developed. The numerical simulation results show the thickness distribution of liquid film in the grooves is not uniform. The temperature and velocity field in vapor chamber are obtained. The thickness of the liquid film in groove is mainly influenced by pressure of vapor and liquid beside liquid-vapor interface. The thin liquid film in heat source region can enhance the performance of vapor chamber, but if the starting point of liquid film is backward beyond the heat source region, the vapor chamber will dry out easily. The optimal filling ratio should maintain steady thin liquid film in heat source region of vapor chamber. The vapor condenses on whole condensation surface, so the condensation surface achieves great uniform temperature distribution. By comparing the experimental results with numerical simulation results, the reliability of the numerical model can be verified.

Keyword:

vapor chamber grooved structure electronics cooling

Author Community:

  • [ 1 ] Beijing Univ Technol, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100022, Peoples R China

Reprint Author's Address:

  • 刘中良

    [Liu, Zhongliang]Beijing Univ Technol, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100022, Peoples R China

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Source :

NANOSCALE HEAT TRANSFER INTERNATIONAL CONFERENCE 2008, PTS A AND B

Year: 2008

Page: 923-929

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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