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Author:

Liu, Xiucheng (Liu, Xiucheng.) | Ma, Kun (Ma, Kun.) | Wang, Lei (Wang, Lei.) | Shang, Wangli (Shang, Wangli.) | Wu, Bin (Wu, Bin.) | He, Cunfu (He, Cunfu.) (Scholars:何存富)

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Abstract:

The strength of the tangential magnetic field (TMF) near the tested material surface is an important scale for understanding the signal obtained from micro-magnetic testing.The measurement accuracy of TMF directly affects the precision of micro-magnetic testing.A new method is proposed to accurately measure the strength of TMF.A Hall sensor array is employed to simultaneously measure the TMF at three given positions and then linear extrapolation operation is applied to the measured results to estimate the strength of TMF at the material surface.A regulator structure, whose sizes are optimized by finite element simulations, is placed in the space between the two legs of the ferrite core to improve the distribution of TMF.More precisely, the regulator structure can help to reduce the slope of the strength of TMF along the direction vertical to the material surface.Consequently, the measurement accuracy of TMF can be improved and the effect of variation in lift-off distance on the measurement results can be suppressed.Experimental tests are conducted in plate specimen of 65Mn steel.The obtained results show that with the linear extrapolation method the sensor possesses higher accuracy in measuring the magnetic hysteresis curve than the cases of current-based estimation method and the method using single Hall device.In addition, when the lift-off distance of the ferrite core from the material surface is in the range of 0~0.5mm, the measurement error to the saturated and residual magnetic induction intensity are less than 1.13%. © 2020, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.

Keyword:

Magnetic field measurement Magnetic fields Hall effect transducers Magnetic cores Surface properties Magnetic hysteresis Extrapolation Testing Curve fitting Ferrite Ferrite devices

Author Community:

  • [ 1 ] [Liu, Xiucheng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Ma, Kun]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Wang, Lei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Shang, Wangli]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 何存富

    [he, cunfu]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china

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Source :

Journal of Basic Science and Engineering

ISSN: 1005-0930

Year: 2020

Issue: 1

Volume: 28

Page: 235-245

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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