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Author:

Shi, Junbiao (Shi, Junbiao.) | Zhao, Yun (Zhao, Yun.) | Chen, Shujun (Chen, Shujun.) (Scholars:陈树君) | Chi, Xing (Chi, Xing.)

Indexed by:

EI Scopus CSCD

Abstract:

The method for manufacturing grid panels that deposits material directly on the substrate layer by layer can considerably improve the production efficiency and reduce cost. In the process of forming grid panels, the formation of the base layer and the entire thermal process determine whether the upper layer can be successfully formed. The parameters of the finite element heat source model were generated by measuring the morphology of the base layer for wire arc additive manufacturing through different plate thickness experiments. The influence of substrate thickness, preheating temperature, and distance from the edge on the width of the base layer for wire arc additive manufacturing was investigated by finite element simulation. The experimental results show that with the increase in the thickness of the substrate, the forming width of the base layer decreases significantly. With the increase in the preheating temperature, the width does not increase significantly when the temperature is within 80, whereas the width increases significantly when the temperature exceeds 120. The decrease in the distance from the edge has only a slight effect on the forming width beyond the range of 20mm and gradually increases the forming width within the range of 20mm. When the distance from the edge is 10mm, the temperature of the entire edge base plate reaches 500, and the collapse tendency of the base plate becomes obvious. On the basis of the results of the experiments, the mathematical model of the formation of the base layer is established according to the thermodynamic theory to help determine the heat source parameters and combined with the statistical least square method. This novel prediction method can be extended to the analysis and study of the heating process of wire arc additive manufacturing with different process parameters and plate thicknesses. © 2020, Editorial Board of Journal of Tianjin University(Science and Technology). All right reserved.

Keyword:

Substrates Temperature Wire Plates (structural components) Least squares approximations 3D printers Additives Industrial research Finite element method Preheating Morphology

Author Community:

  • [ 1 ] [Shi, Junbiao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Shi, Junbiao]Engineering Research Center of Advanced Manufacturing Technology for Automotive Components, Ministry of Education, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Zhao, Yun]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Zhao, Yun]Engineering Research Center of Advanced Manufacturing Technology for Automotive Components, Ministry of Education, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Chen, Shujun]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Chen, Shujun]Engineering Research Center of Advanced Manufacturing Technology for Automotive Components, Ministry of Education, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [Chi, Xing]Mechanical Department of Guizhou Equipment Manufacturing Vocational College, Guiyang; 550008, China

Reprint Author's Address:

  • 陈树君

    [chen, shujun]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china;;[chen, shujun]engineering research center of advanced manufacturing technology for automotive components, ministry of education, beijing university of technology, beijing; 100124, china

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Source :

Journal of Tianjin University Science and Technology

ISSN: 0493-2137

Year: 2020

Issue: 9

Volume: 53

Page: 910-916

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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