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Author:

Wu, Qi (Wu, Qi.) | Li, Jianan (Li, Jianan.) | Long, Lianchun (Long, Lianchun.) (Scholars:龙连春) | Liu, Linao (Liu, Linao.)

Indexed by:

EI Scopus SCIE

Abstract:

During heat treatment or mechanical processing, most polycrystalline materials experience grain growth, which significantly affects their mechanical properties. Microstructure simulation on a mesoscopic scale is an important way of studying grain growth. A key research focus of this type of method has long been how to efficiently and accurately simulate the grain growth caused by a non-uniform temperature field with temperature gradients. In this work, we propose an improved 3D Monte Carlo Potts (MCP) method to quantitatively study the relationship between non-uniform temperature fields and final grain morphologies. Properties of the aluminum alloy AA6061-T6 are used to establish a trial calculation model and to verify the algorithms with existing experimental results in literature. The detailed grain growth process of the 6061-T6 aluminum alloy under different temperature fields is then obtained, and grain morphologies at various positions are analyzed. Results indicate that while absolute temperature and duration time are the primary factors determining the final grain size, the temperature gradient also has strong influence on the grain morphologies. The relationships between temperatures, temperature gradients and grain growth process have been established. The proposed MCP algorithm can be applied to different types of materials when the proper parameters are used.

Keyword:

polycrystalline materials Grain growth temperature gradient aluminum alloy Monte Carlo method

Author Community:

  • [ 1 ] [Wu, Qi]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Li, Jianan]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Long, Lianchun]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Liu, Linao]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Wu, Qi]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

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Source :

CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES

ISSN: 1526-1492

Year: 2021

Issue: 1

Volume: 129

Page: 99-116

2 . 4 0 0

JCR@2022

ESI Discipline: COMPUTER SCIENCE;

ESI HC Threshold:87

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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