Excellent　mechanical　and　physical　properties　are　usually　mutually　exclusive　in　W-Cu　composites,　which　makes　it　challenging　to　achieve　outstanding　comprehensive　performance.　In　the　present　work,　improved　copper　connectivity　and　uniformly　dispersed　ultrafine　tungsten　particles　were　achieved　in　the　ultrafine　grained　(UFG)　W-Cu　composites.　The　as-prepared　UFG　W-Cu　composites　exhibited　enhanced　combination　of　hardness,　compressive　strength　and　electrical　conductivity　compared　with　those　reported　in　the　literature.　Specifically,　the　UFG　W-30Cu　composite　showed　a　compressive　strength　over　1200　MPa　(2.1　times　that　of　the　coarse　grained　counterpart),　a　hardness　of　357　HV　and　an　electrical　conductivity　of　48.6%IACS.　The　strengthening　mechanisms　of　the　presented　W-Cu　composites　were　quantitatively　discussed　in　terms　of　grain　refinement,　stress　transfer　and　dislocations　strengthening.　This　study　provides　a　novel　approach　for　the　synthesis　of　W-Cu　composites　with　excellent　comprehensive　properties.