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Author:

Gong, Yu (Gong, Yu.) | Huang, Xiaofei (Huang, Xiaofei.) | Liu, Zenghua (Liu, Zenghua.) | Deng, Fei (Deng, Fei.) | Wu, Yufeng (Wu, Yufeng.) | He, Cunfu (He, Cunfu.)

Indexed by:

EI Scopus SCIE

Abstract:

Compared with the conventional eddy current, pulsed eddy current (PEC) technology has the characteristic of abundant components in the frequency domain, which is a significant technological advancement. Improvements in the production and performance of PEC sensors are necessary for nondestructive testing. Sensor configuration parameters have significant influence on the development of PEC system. In this study, through finite element simulation and experimental investigation, different optimization methods for PEC sensors are compared and studied. According to the eddy current detection principle, a two-dimensional finite element simulation model was established to study the influence of the shape and size parameters of cone-shaped PEC sensors. Then a cone-shaped PEC sensor was optimized by the orthogonal methodology and the response surface methodology, respectively. To compare the effectiveness of the optimization methods, two optimized sensors were fabricated. It was demonstrated that the combination of finite element method and response surface methodology was superior for improving the detection performance of the PEC sensor compared with the orthogonal methodology. The result also indicated that the developed cone-shaped PEC sensor had a stronger defect detection capability than cylindrical-shaped PEC sensors. The proposed optimization design method provides a feasible reference method for the design of PEC sensors and corresponding parameters.

Keyword:

Magnetic sensors orthogonal experiment methodology Response surface methodology response surface methodology non-destructive testing Sensors Pulsed eddy current sensor Magnetic fields Sensor phenomena and characterization Magnetic flux density Finite element analysis finite element model

Author Community:

  • [ 1 ] [Gong, Yu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Huang, Xiaofei]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Liu, Zenghua]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Wu, Yufeng]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [He, Cunfu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 6 ] [Huang, Xiaofei]Beijing Univ Technol, Beijing Engn Res Ctr Precis Measurement Technol &, Beijing 100124, Peoples R China
  • [ 7 ] [Liu, Zenghua]Beijing Univ Technol, Beijing Engn Res Ctr Precis Measurement Technol &, Beijing 100124, Peoples R China
  • [ 8 ] [He, Cunfu]Beijing Univ Technol, Beijing Engn Res Ctr Precis Measurement Technol &, Beijing 100124, Peoples R China
  • [ 9 ] [Deng, Fei]Shanghai Inst Technol, Sch Elect & Elect Engn, Shanghai 201418, Peoples R China

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Source :

IEEE SENSORS JOURNAL

ISSN: 1530-437X

Year: 2022

Issue: 4

Volume: 22

Page: 3129-3136

4 . 3

JCR@2022

4 . 3 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 18

SCOPUS Cited Count: 23

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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