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Author:

Wang, Luyan (Wang, Luyan.) | Yu, Yueguang (Yu, Yueguang.) | Zhang, Peng (Zhang, Peng.) | Yang, Jiancan (Yang, Jiancan.)

Indexed by:

EI Scopus SCIE

Abstract:

A reasonable preparation processing of Lanthanum-doped tungsten wire plays a decisive role in the final properties of the wire. This paper gives the optimum drawing process parameters of lanthanum-doped tungsten wire with phi 1.00 mm-phi 0.50 mm and explains the phenomenon of coarsening of fiber-like grains in the preparation processing of tungsten wire. The final optimum process parameters of lanthanum-doped tungsten wire are given: the temperature is 950 degrees C (the first pass temperature is 950 degrees C, and the temperature decreases by about 20 degrees C for each pass), the compression ratio is 15%, mold temperature is 550 degrees C, because of the limitation of equipment conditions, the wire drawing speed is fixed at 0.19 m/s. It is found that the fiber-like grains of the tungsten wire coarsen when the temperature is too high, and it is prone to breakage when the temperature is too low during the drawing process. When the compression ratio is too high (for example, 22%), there is a negative impact on the surface quality and the straightness of the tungsten wire. When the compression ratio is too low, the processing die time is increased, and the production cost is increased.

Keyword:

processing mechanical behavior lanthanum-doped tungsten wire microstructure

Author Community:

  • [ 1 ] [Wang, Luyan]Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
  • [ 2 ] [Wang, Luyan]BGRIMM Technol Grp, Beijing 100160, Peoples R China
  • [ 3 ] [Yu, Yueguang]China Iron & Steel Res Inst Grp, Beijing 100081, Peoples R China
  • [ 4 ] [Zhang, Peng]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Yang, Jiancan]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

MATERIALS

Year: 2022

Issue: 14

Volume: 15

3 . 4

JCR@2022

3 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:66

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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