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Author:

Wang, Wanfu (Wang, Wanfu.) | Sun, Shibing (Sun, Shibing.) | Zhao, Xinxin (Zhao, Xinxin.) | Cui, Suping (Cui, Suping.) | Wang, Junchao (Wang, Junchao.) | Shi, Yan (Shi, Yan.) | Sun, Dawei (Sun, Dawei.) | Liu, Hui (Liu, Hui.) | Jin, Xiaodong (Jin, Xiaodong.)

Indexed by:

EI Scopus SCIE

Abstract:

The hydrophobic surface of extruded polystyrene foams (XPSF) was modified by UV curable adhesives to enhance the interfacial bonding strength (BS) with mortar. The UV adhesive contained epoxy acrylate resin, acrylic acid and butyl acrylate (denoted as EAB). After EAB modification, the BS value in dry state (BS-D) increased from 0.050 MPa of unmodified XPSF with mortar to 0.210 MPa. Then, 3-aminopropyltriethoxysilane (APTES) was further introduced into EAB to form the water-resistant coatings (denoted as EABT) to enhance the BS value in wet state (BS-W). By optimizing the composition, the maximum BS-D and BS-W of 0.216 and 0.158 MPa in 7-day curing were obtained. The bonding mechanism illustrated that the modified XPSF was chemically bonded with mortar.

Keyword:

Extruded polystyrene foams Mechanism Water resistance UV curing Interfacial bonding

Author Community:

  • [ 1 ] [Wang, Wanfu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Sun, Shibing]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Zhao, Xinxin]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Cui, Suping]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [Wang, Junchao]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 6 ] [Shi, Yan]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 7 ] [Sun, Dawei]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 8 ] [Liu, Hui]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 9 ] [Jin, Xiaodong]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 10 ] [Zhao, Xinxin]ShanDong GRINM RS Semicond Mat Co Ltd, Dezhou 253084, Peoples R China

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Source :

CONSTRUCTION AND BUILDING MATERIALS

ISSN: 0950-0618

Year: 2022

Volume: 359

7 . 4

JCR@2022

7 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:66

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 7

SCOPUS Cited Count: 7

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

Affiliated Colleges:

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