Pure　Copper　(Cu)　is　very　difficult　to　prepare　using　selective　laser　melting　(SLM)　technology.　This　work　successfully　prepared　the　pure　Cu　with　high　relative　density　and　high　strength　by　the　SLM　technology　using　a　surface　oxidation　treatment.　The　gas-atomized　pure　Cu　powder　was　used　as　the　feedstock　in　this　work.　Before　the　SLM　process,　the　pure　Cu　powder　was　initially　handled　using　the　surface　oxidation　treatment　to　coat　the　powder　with　an　extremely　thin　layer　of　Cu2O.　The　SLMed　highly　dense　specimens　contain　alpha-Cu　and　nano-Cu2O　phases.　A　relationship　between　the　processing　parameters　(laser　power　(LP),　scanning　speed　(SS),　and　hatch　space　(HS))　and　density　of　Cu　alloy　in　SLM　was　also　investigated.　The　microstructure　of　SLMed　Cu　consists　of　fine　grains　with　grain　sizes　ranging　from　0.5　to　~30　mu　m.　Tensile　testing　and　detailed　microstructural　characterization　were　performed　on　specimens　in　the　as-SLMed　and　pure　copper　state　specimens.　The　mechanical　property　experiments　showed　that　the　specimens　prepared　by　SLM　technology　containing　nano-oxide　phases　had　higher　yield　strength　and　tensile　strength　than　that　of　other　SLM-built　pure　copper.　However,　the　elongation　was　remarkably　decreased　compared　to　other　SLM-built　pure　copper,　due　to　the　fine　grains　and　the　nano-oxides.