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Author:

Wang, Chen (Wang, Chen.) | Liu, Chuanping (Liu, Chuanping.) | Li, Chuan (Li, Chuan.)

Indexed by:

EI Scopus SCIE

Abstract:

Material composition can ensure structural strength and avoid leakage of phase change materials. Here, a novel preparation method was present for shape-stabilized composite phase change materials of photosensitive resin and polyethylene glycol via UV curing, in which the resin was cured into the supporting frame and used to encapsulate polyethylene glycol. The thermal and mechanical performance of the samples composited by the proposed method were measured. The sample with PEG of 50 % resin mass fraction melted at 33.16 degrees C with a latent heat of 11.30 J/g. The stress-strain curves exhibited that the samples produced plastic deformation and ultimate compression strength (sigma b) and yield strength (sigma s) increased with the increase in the resin mass fraction. With increasing monolayer curing depth and exposure time during printing, sigma b first increased and then decreased. In this work, the optimal monolayer exposure time was 13.5 s, and the monolayer curing depth was 40 mu m for the sample with a 50 % resin mass fraction.

Keyword:

Phase change materials Mechanical property DLP printing Porous structure Thermal energy storage

Author Community:

  • [ 1 ] [Wang, Chen]Univ Sci & Technol Beijing, Sch Energy & Environm Engn, Beijing 100083, Peoples R China
  • [ 2 ] [Liu, Chuanping]Univ Sci & Technol Beijing, Sch Energy & Environm Engn, Beijing 100083, Peoples R China
  • [ 3 ] [Li, Chuan]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Liu, Chuanping]Univ Sci & Technol Beijing, Sch Energy & Environm Engn, Beijing 100083, Peoples R China;;[Li, Chuan]Beijing Univ Technol, Coll Environm & Energy Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Beijing 100124, Peoples R China;;

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Source :

ADDITIVE MANUFACTURING

ISSN: 2214-8604

Year: 2022

Volume: 61

1 1 . 0

JCR@2022

1 1 . 0 0 0

JCR@2022

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 8

SCOPUS Cited Count: 8

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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