Evaporative　microchannel　cooling　is　a　perspective　approach　to　be　implemented　in　future　3D　integrated　high-performance　processors　and　in　the　next　generation　of　power　electronics.　In　the　present　work,　numerical　and　theoretical　approaches　for　the　verification　of　the　methodology　of　the　experimental　investigation　of　heat　transfer　in　a　flat　microchannel　have　been　applied.　The　experimental　methodology　for　a　broad　range　of　conditions,　beginning　from　the　convective　heat　transfer　up　to　the　experiment　with　shear-driven　liquid　film　under　intense　heating,　has　been　verified.　The　advantages　of　the　shear-driven　liquid　films　in　terms　of　the　critical　heat　flux　against　the　saturated　and　the　subcooled　pool　boiling　have　been　demonstrated.