Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5 - Details

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Abstract：

The　morphology,　orientation　and　growth　relationships　of　the　intermetallic　compounds　(IMCs)　Ag3(Sn,　In)　and　Cu6(Sn,　In)5　at　the　Sn-3.5Ag-0.5Bi-8.0In　solder/Cu　substrate　interface　were　investigated.　The　Ag(Sn,　In)　at　the　interface　is　＂flower-like＂.　However,　when　the　reflow　parameters　were　changed　and　the　cooling　rate　was　increased,　Ag3(Sn,　In)　had　difficulty　in　nucleation.　A　preferential　orientation　relationship　between　the　Ag3(Sn,　In)　phase　and　the　Cu6(Sn,　In)5　substrate　was　established.　An　angle　of　35°　existed　between　the　adjacent　Ag3(Sn,　In)　grains　and　Cu6(Sn,　In)5　grains.　In　addition,　coincident　mismatch　relationships　were　found　between　specific　crystallographic　planes　of　Ag3(Sn,　In)　and　Cu6(Sn,　In)5.　The　(001)　crystallographic　plane　of　Ag3(Sn,　In)　and　the　(0001)　crystallographic　plane　of　Cu6(Sn,　In)5　have　a　mismatch　of　12.23%　and　are　more　likely　to　form　a　coherent　interface.　©　2023　Elsevier　B.V.

Keyword：

EPMA EBSD Sn-3.5Ag-0.5Bi-8.0In In) TEM Flower-like Ag3(Sn Interfacial relationship

Author Community：

[ 1 ] [Han J.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Meng Z.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Jin X.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Ma L.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 5 ] [Ma L.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing, 100124, China
[ 6 ] [Guo F.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 7 ] [Guo F.]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing, 100124, China
[ 8 ] [Zhou W.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 9 ] [Wang Y.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
[ 10 ] [An T.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China

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Source ：

Materials Chemistry and Physics

ISSN： 0254-0584

Year： 2023

Volume： 297

4 . 6 0 0

JCR@2022

ESI Discipline： MATERIALS SCIENCE;

ESI HC Threshold：26

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 2

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 7

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