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Author:

Jiang, S. (Jiang, S..) | Zhang, M. (Zhang, M..) | Meng, X. (Meng, X..) | Zheng, X. (Zheng, X..) | Feng, S. (Feng, S..) | Zhang, Y. (Zhang, Y..)

Indexed by:

EI Scopus SCIE

Abstract:

The SiC/SiO2 interface state is one of the main factors that limit the performance and reliability of the SiC metal-oxide-semiconductor field-effect transistor (MOSFET). In this paper, we use a Bayesian deconvolution algorithm to optimize trap feature extraction based on the transient current method and improve the trap extraction accuracy. Using this method, we study the trap capture mechanism in SiC MOSFETs and mainly characterize the trap position, the trap energy level, and the capture time constant. The results obtained show that there are three different types of traps and defects, two of which are SiC interface traps at the gate-source and gate-drain interfaces, with activation energies of 0.089 eV and 0.035 eV, respectively; the third trap type is an oxide trap, and its time constant does not vary with temperature. The characterization results are verified via deep level transient spectroscopy, and the results show reasonable agreement with those obtained by the method proposed in this paper. This method can be combined with electrical stress testing in long-term reliability research to realize nondestructive characterization of the defects of SiC MOSFETs. IEEE

Keyword:

Silicon carbide Deconvolution Charge trapping current transient Logic gates trench silicon carbide metal-oxide-semiconductor field-effect transistor SiC MOSFET Transient analysis Electron traps Bayes methods reliability Reliability

Author Community:

  • [ 1 ] [Jiang S.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 2 ] [Zhang M.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 3 ] [Meng X.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 4 ] [Zheng X.]Center for Device Thermography and Reliability, University of Bristol, Bristol, U.K
  • [ 5 ] [Feng S.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 6 ] [Zhang Y.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China

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Source :

IEEE Transactions on Power Electronics

ISSN: 0885-8993

Year: 2023

Issue: 5

Volume: 38

Page: 1-9

6 . 7 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:19

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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