The　applicability　of　wide　bandage　semiconductors　at　high　temperatures　promotes　the　development　of　high-temperature　die-attach　materials,　such　as　silver　nanoparticles　(Ag　NPs)　paste.　To　enhance　the　bonding　between　Ag　NPs　and　Cu　substrate　through　an　interdiffusion　process,　the　Cu　substrate　was　modified　by　electroplating　a　novel　upright　shell-like　nanostructure.　The　optimized　Cu　substrate　was　then　sintered　with　Ag　NPs　paste,　in　which　the　diffusion　distance　could　achieve　about　1.5　μm　at　300　°C　for　20　min.　This　sufficient　interfacial　diffusion　is　attributed　to　the　numerous　reactive　positions　and　compatible　sintering　driving　force　between　Ag　NPs　and　modified　Cu　substrate　caused　by　the　upright　shell-like　Cu　nanostructure.　　©　2022　IEEE.