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Author:

Sun, K. (Sun, K..) | Sun, M. (Sun, M..) | Chen, C. (Chen, C..) | Chen, S. (Chen, S..) | Fan, J. (Fan, J..) | Diao, D. (Diao, D..)

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EI Scopus SCIE

Abstract:

We report on the structural evolution and low-friction behaviour of silicon (Si) doped amorphous carbon (a-C) films. Si-doped a-C films were fabricated by controlling the magnetron Si target currents under an electron cyclotron resonance (ECR) plasma system. Structural analysis indicated that Si atoms doped into the a-C lattice preferentially replaced certain sp3 C atoms, and subsequently formed bonds with other sp3 C atoms. Nanoindentation and nanoscratch tests showed that the Si-doped a-C films had hard surfaces with a hardness of approximately 24 GPa and a scratch depth of 40–60 nm. Ball-on-disk tribological evaluations further showed that these films exhibited low-friction behaviour, with a minimal friction coefficient of 0.02. Detailed transfer film characterisation revealed the formation of rich oxide and graphene structures within the stable contact-sliding interface of the Si-doped a-C film. The low friction mechanism was summarized as H–H interactions from the surface terminal passivation of Si dangling bond with hydroxide (-OH) or hydrogen (-H) groups and π*-π* interactions occurring between the graphene layers co-reducing the friction force. These findings shed light on the significance of doped Si atoms in the structural design and low-friction applications of carbon films. © 2023

Keyword:

Low friction Structural evolution Amorphous carbon Doped silicon

Author Community:

  • [ 1 ] [Sun K.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Sun M.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Chen C.]Institute of Nanosurface Science and Engineering (INSE), Shenzhen University, Shenzhen, 518060, China
  • [ 4 ] [Chen S.]School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
  • [ 5 ] [Fan J.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [Diao D.]Institute of Nanosurface Science and Engineering (INSE), Shenzhen University, Shenzhen, 518060, China

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Source :

Carbon

ISSN: 0008-6223

Year: 2023

Volume: 215

1 0 . 9 0 0

JCR@2022

ESI Discipline: CHEMISTRY;

ESI HC Threshold:20

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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