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Author:

高坤元 (高坤元.) (Scholars:高坤元) | 杨倩 (杨倩.) | 丁宇升 (丁宇升.) | 聂祚仁 (聂祚仁.) (Scholars:聂祚仁) | 文胜平 (文胜平.) | 黄晖 (黄晖.) (Scholars:黄晖) | 吴晓蓝 (吴晓蓝.)

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incoPat zhihuiya

Abstract:

一种高性价比高强高导的Al‑Sc‑Zr‑Yb合金及其热处理工艺,属于合金技术领域。合金为在在铝基体中加入了0.193~0.256%(重量百分比)的Sc,0.187~0.243%(重量百分比)的Zr,0.077~0.109%(重量百分比)的Yb。该合金的热处理工艺首先在640±10℃下固溶处理40~50小时,水淬至室温,然后在350~400℃之间进行96~144h的等温时效。本发明由于采用了Sc、Zr、Yb的复合微合金化,合金不仅同时具备显著的时效强化效果和良好的导电性,而且在取得相同硬度值的情况下,相较于Al‑Sc‑Zr合金,Al‑Sc‑Zr‑Yb合金的价格可降低30元/千克,具有高性价比。

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Patent Info :

Type: 发明授权

Patent No.: CN201611065568.7

Filing Date: 2016-11-28

Publication Date: 2019-01-29

Pub. No.: CN106756265B

Applicants: 北京工业大学

Legal Status: 授权

Cited Count:

WoS CC Cited Count: 36

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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