• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

聂祚仁 (聂祚仁.) (Scholars:聂祚仁) | 李健飞 (李健飞.) | 文胜平 (文胜平.) | 王为 (王为.) | 高坤元 (高坤元.) (Scholars:高坤元) | 黄晖 (黄晖.) (Scholars:黄晖) | 吴晓蓝 (吴晓蓝.)

Indexed by:

incoPat zhihuiya

Abstract:

一种Al-Er-Cu高强高导电率铝合金及其制备工艺,属于合金技术领域。所述合金为在铝基体中加入了0.22~0.27%的Er,0.55~1.09%的Cu。在770±10℃下熔炼Al-Er-Cu合金,充分搅拌,然后浇铸得到铸态合金。其固溶时效热处理工艺如下:首先在640±10℃固溶24小时,随后水淬到室温,然后将合金在100~475℃之间每隔25℃等时时效3个小时。其形变热处理工艺如下:将固溶处理合金冷轧后在100~475℃之间每隔25℃等时时效3个小时,或者将固溶+冷轧,峰时效+冷轧后合金在200℃等温退火。本发明采用了Cu的固溶强化、析出相强化与加工硬化,在退火过程中析出了大量的纳米级强化相粒子,使得合金在退火过程中强化,且进一步提高合金的导电率。

Keyword:

Reprint Author's Address:

Email:

Show more details

Related Keywords:

Related Article:

Patent Info :

Type: 发明申请

Patent No.: CN201510330991.4

Filing Date: 2015-06-15

Publication Date: 2015-09-30

Pub. No.: CN104946943A

Applicants: 北京工业大学

Legal Status: 驳回

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 17

Online/Total:1133/10559076
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.