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Author:

Ding, Jun-Cai (Ding, Jun-Cai.) | Wu, Bin (Wu, Bin.) | He, Cun-Fu (He, Cun-Fu.) (Scholars:何存富)

Indexed by:

EI Scopus PKU CSCD

Abstract:

It is a difficult and challenging subject for ultrasonic inspection to test and evaluate the debonding interface of adhesive structure. Assuming, the debonding interface layer to be a fluid thin layer, the acoustic reflection and transmission coefficient expressions were derived based on the transfer matrix method for the body waves striking debonding structure with fluid-solid (gas-solid and liquid-solid) coupling interfaces. Firstly, this method was applied to a two-layered structure and the correctness of the method was verified by comparing with the existing results. Then, the influences of the incident angle and frequency changes of the acoustic wave on the body wave propagation characteristics were analyzed for adhesive structure with rigid interfaces and debonding structure with fluid-solid coupling interfaces. The results show that the propagation modes of the body waves in the multilayered structure mainly dependent on the incident angle, frequency and other parameters. The rigid interfaces, gas-solid and liquid-solid coupling interfaces can be distinguished in the case of the incident angle and frequency of the acoustic wave are appropriate. The research results provide a theoretical reference for identifying the adhesive interface debonding with ultrasonic spectrum technique. © 2017, Editorial Department of Transaction of Beijing Institute of Technology. All right reserved.

Keyword:

Acoustic waves Debonding Acoustics Rigid structures Transmissions Testing Adhesives Acoustic wave propagation Ultrasonic testing Phase interfaces Transfer matrix method

Author Community:

  • [ 1 ] [Ding, Jun-Cai]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [He, Cun-Fu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • [ding, jun-cai]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china

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Source :

Transaction of Beijing Institute of Technology

ISSN: 1001-0645

Year: 2017

Issue: 3

Volume: 37

Page: 221-226 and 249

Cited Count:

WoS CC Cited Count: 36

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 11

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