In　this　paper,　temperature　cycling,　random　vibration　and　combined　loading　tests　were　conducted　on　plastic　ball　grid　array　assemblies.　The　fatigue　lives,　the　failure　modes　of　the　solder　joints　and　the　location　of　the　failed　solder　joints　for　single　loading　and　combined　loading　conditions　were　compared　and　analyzed.　The　results　show　much　earlier　solder　joint　failure　for　combined　loading　than　that　for　either　temperature　cycling　or　pure　vibration　loading　at　room　temperature.　During　temperature　cycling　and　random　vibration　loading　tests,　the　components　at　the　central　region　have　more　failed　solder　joints　than　other　components.　The　effect　of　the　component　location　on　the　stresses　and　strains　at　the　solder　joints　is　not　significant　for　combined　loading.　The　primary　failure　mode　is　cracking　within　the　bulk　solder　under　temperature　cycling,　whereas　the　crack　propagation　path　is　along　the　intermetallic　compound　(IMC)　layer　for　vibration　loading.　The　solder　joints　subjected　to　combined　loading　exhibit　both　failure　modes　that　occur　for　the　temperature　cycling　and　the　vibration　loading　conditions.　©　2021,　Editorial　Board　of　Transactions　of　the　China　Welding　Institution,　Magazine　Agency　Welding.　All　right　reserved.