With　the　development　of　advanced　IC　packaging　technology,　wafers　are　required　to　become　thinner　and　thinner.　The　12-inch　memory　wafer　has　reached　within　25um,　which　requires　a　higher-performance　aerostatic　spindle　of　the　wafer　grinder.　The　spindle　motor　power　of　the　wafer　grinder　is　large,　which　generates　a　lot　of　heat.　The　heat　causes　the　temperature　rise　of　the　aerostatic　spindle,　which　adversely　affects　the　wafer　grinding　accuracy　and　the　reliability　of　the　spindle　motor　operation.　In　this　paper,　the　field-circuit　coupling　model　of　the　spindle　motor　in　the　aerostatic　spindle　is　established.　The　transient　two-dimensional　electromagnetic　field　is　analyzed,　and　the　no-load　and　load　characteristics　of　the　motor　are　obtained,　which　provides　theoretical　support　for　the　design　of　the　spindle　motor.　Using　motor　loss　as　the　heat　source,　through　the　one-way　coupling　of　electromagnetic　field　and　temperature　field,　establish　an　aerostatic　spindle　thermal　analysis　model,　and　the　steady-state　temperature　field　of　the　aerostatic　spindle　and　the　rotating　shaft　is　simulated　and　analyzed,　and　the　temperature　distribution　of　the　aerostatic　spindle　and　the　rotating　shaft　is　obtained,　and　the　thermal　deformation　is　analyzed.　This　paper　has　certain　reference　value　for　the　optimization　design　of　aerostatic　spindle.　©　2021　IEEE.