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Author:

He, Cunfu (He, Cunfu.) (Scholars:何存富) | Zheng, Mingfang (Zheng, Mingfang.) | Lv, Yan (Lv, Yan.) (Scholars:吕炎) | Deng, Peng (Deng, Peng.) | Zhao, Huamin (Zhao, Huamin.) | Liu, Xiucheng (Liu, Xiucheng.) | Song, Guorong (Song, Guorong.) | Liu, Zenghua (Liu, Zenghua.) (Scholars:刘增华) | Jiao, Jingpin (Jiao, Jingpin.) (Scholars:焦敬品) | Wu, Bin (Wu, Bin.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

This paper gives an overview of the development and application of guided waves technique for NDT&E in recent 30 years. Firstly, the fundamental concepts of guided waves propagation and their characteristics are explained, and the mechanical loading principles and mode selection principles for guided wave excitation is analyzed thoroughly. Secondly, the transducer excitation method and its apparatus for ultrasonic guided waves are introduced, then the features and applications are discussed among different excitation methods. Thirdly, ultrasonic guided wave applications in plates, tubes and composite materials are described, meanwhile, the time reversal and the phased array method are introduced to improve the capability of defect detection. Finally, the challenges and opportunities in of guided ultrasonic waves in future are outlined. © 2016, Science Press. All right reserved.

Keyword:

Nondestructive examination Ultrasonic testing Glass ceramics Antenna phased arrays Guided electromagnetic wave propagation Dispersion (waves) Defects Ultrasonic waves

Author Community:

  • [ 1 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Zheng, Mingfang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Lv, Yan]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Deng, Peng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Zhao, Huamin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Liu, Xiucheng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [Song, Guorong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 8 ] [Liu, Zenghua]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 9 ] [Jiao, Jingpin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 10 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 吕炎

    [lv, yan]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china

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Source :

Chinese Journal of Scientific Instrument

ISSN: 0254-3087

Year: 2016

Issue: 8

Volume: 37

Page: 1713-1735

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 14

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