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Author:

Gao, Yihang (Gao, Yihang.) | Shi, Yuhong (Shi, Yuhong.) | Wang, Kunpeng (Wang, Kunpeng.) | Yang, Yunxia (Yang, Yunxia.) | Long, Lianchun (Long, Lianchun.) (Scholars:龙连春) | Pan, Lingying (Pan, Lingying.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

The high-temperature mechanical properties of carbon fiber reinforced polyimide resin matrix MT300/KH420 composites were studied both in macro and micro scale, during which the flexural property variation rule for MT300/KH420 composites of laminates with ply orientation of [0°]14 and [±45°/0°/90°/+45°/0°2]s were especially analyzed at temperature ranging from ambient temperature to 500. Research shows that MT300/KH420 composite has good mechanical property at high temperature. The flexural strength of [0°]14 laminates exhibit a 51% retention at 420, while at 500 it changes little. At ambient temperature, [0°]14 laminates exhibit brittle fractures with a rough facture surface and crack growth direction along thickness. As temperature rises, resin tends to have a stronger flowability, leading to a viscoelastic behavior, while failure mainly occurs at the loading nose. At 500, thermal exposure has caused the decomposition of resin matrix, leaving separations between the bundles of the oxidated fibers. As for [±45°/0°/90°/+45°/0°2]s laminates, the flexural properties show a more stable retention at high temperature. Crack along 45° direction at outer surfaces as well as interlamination are the main failure modes. At 500, a severe delamination happens. Compared with matrix-dominated laminates, the flexural properties of fiber-dominated ones are less dependent on temperature. © 2016, BUAA Culture Media Group Ltd. All right reserved.

Keyword:

Crack propagation Composite materials Cracks Carbon fibers Resins Bending strength Polyimides Temperature Laminated composites Fibers

Author Community:

  • [ 1 ] [Gao, Yihang]Beijing Institute of Aerospace Systems Engineering, Beijing; 100076, China
  • [ 2 ] [Shi, Yuhong]Beijing Institute of Aerospace Systems Engineering, Beijing; 100076, China
  • [ 3 ] [Wang, Kunpeng]Beijing Institute of Aerospace Systems Engineering, Beijing; 100076, China
  • [ 4 ] [Yang, Yunxia]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Long, Lianchun]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Pan, Lingying]Aerospace Research Institute of Materials & Processing Technology, Beijing; 100076, China

Reprint Author's Address:

  • [gao, yihang]beijing institute of aerospace systems engineering, beijing; 100076, china

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Source :

Acta Materiae Compositae Sinica

ISSN: 1000-3851

Year: 2016

Issue: 12

Volume: 33

Page: 2699-2705

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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