The　complete　and　accurate　acquisition　of　geometric　information　forms　the　bedrock　of　maintaining　high-end　instrument　performance　and　monitoring　product　quality.　It　is　also　a　prerequisite　for　achieving　the　＇precision＇　and　＇intelligence＇　that　the　manufacturing　industry　aspires　to　achieve.　Industrial　microscopes,　known　for　their　high　accuracy　and　resolution,　have　become　invaluable　tools　in　the　precision　measurement　of　small　components.　However,　these　industrial　microscopes　often　struggle　to　demonstrate　their　advantages　when　dealing　with　complex　shapes　or　large　tilt　angles.　This　paper　introduces　a　ray-tracing　model　for　point　autofocus　microscopy,　and　it　provides　the　quantified　relationship　formula　between　the　maximum　acceptable　tilt　angle　and　the　beam　offset　accepted　in　point　autofocus　microscopy,　then　analyzing　the　maximum　acceptable　tilt　angle　of　the　objects　being　measured.　This　novel　approach　uses　the　geometric　features　of　a　high-precision　reference　sphere　to　simulate　the　tilt　angle　and　displacement　of　the　surface　under　investigation.　The　research　findings　show　that　the　maximum　acceptable　tilt　angles　of　a　point　autofocus　microscope　vary　across　different　measured　directions.　Additionally,　the　extent　to　which　the　maximum　acceptable　tilt　angles　are　affected　by　the　distances　of　the　beam　offset　also　varies.　Finally,　the　difference　between　the　experiment　results　and　the　theoretical　results　is　less　than　0.5　degrees.