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Author:

Wu, B. (Wu, B..) | Song, X. (Song, X..) | Gao, J. (Gao, J..) | Song, G. (Song, G..) | Lyu, Y. (Lyu, Y..) | He, C. (He, C..)

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EI Scopus

Abstract:

For composite bonded joints with thick adhesive layers, the finite element method and non-contact ultrasonic testing technology are applied to analyze the ultrasonic reflection characteristics when bonding interfaces are degraded. Firstly, the time domain simulation model of ultrasonic reflection characteristics for fiber-reinforced polymer (FRP) plates under water immersion is established. The variation rule of the acoustic reflection coefficient at different incidence angles is numerically analyzed, and compared with the published theoretical methods. Then, the time-domain simulation model of reflection characteristics of the composite bonding structure with the thick adhesive layer is built. And the effects of interface weakening on ultrasonic reflection characteristics of bonded structures are analyzed by changing the normal spring stiffness. Likewise, the influence of the weakening degree of bonding interface on spectral characteristic points of ultrasonic reflection coefficient is analyzed in detail. Based on the water immersion ultrasonic measurement system, the frequency spectrum of ultrasonic reflection coefficient for normal bonding states is in good agreement with the calculation results of the finite element method. In addition, FRP bonding structures with different bonding interface states are prepared. The relationship between the ultrasonic reflection characteristics in the bonding structure and the bonding quality is analyzed, which is consistent with the simulation data. Based on the regular distribution characteristics between different bonding states and ultrasonic reflection properties, it provides a research idea for the bonding quality assessment of the composite bonded structures. © 2024 Science Press. All rights reserved.

Keyword:

Bonded structure Thick adhesive layer Weak bonding Composite material Ultrasonic reflection

Author Community:

  • [ 1 ] [Wu B.]Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Song X.]Beijing Chenjing Electronics Co., LTD, Beijing, 100120, China
  • [ 3 ] [Gao J.]Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Song G.]Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Lyu Y.]Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [He C.]Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China

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Source :

Acta Acustica

ISSN: 0371-0025

Year: 2024

Issue: 1

Volume: 49

Page: 137-145

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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