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Author:

Liu, Z. (Liu, Z..) | Guo, Y. (Guo, Y..) | Zhao, X. (Zhao, X..) | Cheng, J. (Cheng, J..) | Zheng, K. (Zheng, K..) | He, C. (He, C..)

Indexed by:

EI Scopus SCIE

Abstract:

Ultrasonic surface wave electromagnetic acoustic transducers (EMATs) have been widely utilized in detecting surface defects of metal materials due to their non-contact advantages. However, the signal energy of surface wave EMAT is weak, mainly influenced by energy conversion efficiency. Increasing the number of excitation signal cycles can enhance the signal energy, but it leads to longer pulse width and reduced time-domain resolution. Meanwhile, most of the existing studies excite surface waves with a single frequency, and the frequency information components are limited. To overcome these issues, wideband signal is introduced into the design of surface wave EMAT, and combined with pulse compression technique to obtain surface wave signals with wideband, high amplitude and narrow pulse width. In this paper, a new wideband pulse compression surface wave EMAT (WPCSW-EMAT) is proposed. WPCSW-EMAT replaces the single frequency signal in conventional EMAT with a linear frequency modulation (LFM) signal. Additionally, the equal meander-line coil is replaced by a variable distance meander-line coil, where the distance between adjacent wires matches the frequency change of the LFM signal. Finite element simulation results demonstrate that compared to conventional EMAT, WPCSW-EMAT can obtain pulse compression surface wave signals with wideband frequency, high amplitude, and narrow pulse width. The performance verification experiment and defect detection experiment of EMAT were carried out on aluminum plate samples, and the experimental results indicate that the wideband pulse compression surface wave signal excited by WPCSW-EMAT is more suitable for nondestructive testing of metal materials. IEEE

Keyword:

surface waves EMAT Frequency modulation Acoustics Surface acoustic waves Metals Wideband pulse compression nondestructive testing wideband Magnetic fields Wires

Author Community:

  • [ 1 ] [Liu Z.]Faculty of Information Technology, Beijing University of Technology, Beijing, China
  • [ 2 ] [Guo Y.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China
  • [ 3 ] [Zhao X.]Faculty of Information Technology, Beijing University of Technology, Beijing, China
  • [ 4 ] [Cheng J.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China
  • [ 5 ] [Zheng K.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China
  • [ 6 ] [He C.]Faculty of Information Technology, Beijing University of Technology, Beijing, China

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Source :

IEEE Sensors Journal

ISSN: 1530-437X

Year: 2024

Issue: 4

Volume: 24

Page: 1-1

4 . 3 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 8

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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