In　this　study,　a　repeatable　and　widely　applicable　method　for　decreasing　the　turn　-to　-turn　contact　resistivity　of　REBa2Cu3O7-x　(RE=rare　earth,　REBCO)　tapes　was　demonstrated.　By　applying　a　solder　without　further　connections,　the　contact　resistivity　can　be　significantly　and　consistently　decreased　to　low　values.　Four　solders　and　five　REBCO　tapes　from　various　manufacturers　were　tested　to　demonstrate　the　wide　applicability　of　this　method.　The　lowest　value　achieved　by　using　a　combination　of　solder　and　surface　cleaning　procedure　was　around　3　mu　omega　cm2.　Furthermore,　a　possible　governing　mechanism　for　the　repeatable　decrease　method　using　solder　is　discussed.　The　Mikic　elastic　correlation　was　considered　the　most　probable　candidate.　After　carefully　discussing　the　three　factors　of　contact　resistivity,　namely　surface　roughness,　surface　conductance,　and　surface　Young＇s　modulus,　surface　Young＇s　modulus　was　considered　to　have　a　much　higher　weight　index　than　the　surface　roughness,　and　the　surface　conductance　was　negligible.　This　research　can　help　us　better　understand　the　contact　resistivity　of　REBCO　and　develop　a　method　that　can　controllably　adjust　the　contact　resistivity.