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Author:

Wang, X. (Wang, X..) | Zhang, D. (Zhang, D..) | Li, A. (Li, A..) | Li, T. (Li, T..) | Zhang, W. (Zhang, W..) | Liu, X. (Liu, X..)

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EI Scopus SCIE

Abstract:

The hierarchical porous lattice implant with microscopic porosity, which resembles the original human bone structure, has significant potential application value. The microscopic porosity in the hierarchical porous lattice implant plays a crucial role in transporting nutrients and promoting tissue regeneration. However, it is difficult to fabricate microscopic pores smaller than 200 μm by powder bed fusion (PBF) processes due to the limitations of the laser spot size. In this study, the preparation of a hierarchical porous lattice implant with microscopic porosity is proposed by coupling structure design with the high scanning speed - short hatch spacing (HSSH) process formation. The structure-versus-process relationship is used to control the size and distribution of the microscopic pores, which meets the requirements of modulus and high biocompatibility. This proposed process breaks the inherent law where the higher the porosity, the higher the modulus of the lattice for the same lattice type. The modulus and porosity of the hierarchical porous implants could be flexibly tuned over a wide range (0.1–1.8 GPa and 63–84 %, respectively). The microscopic porosity is mainly distributed near the contour of the core rod, and the macroscopic porosity and microscopic porosity are approximately 73.70 % and 8.22 %, respectively. The problem of large errors in fitting the hierarchical porous lattice modulus calculation model according to the Gibson-Ashby equation has been solved. The mechanism of microscopic porosity formation was also analyzed. Furthermore, this method has the advantage of universal applicability, providing a feasible way for the development and application of porous materials. © 2024 The Society of Manufacturing Engineers

Keyword:

Implant Additive manufacturing SLM Hierarchically porous materials

Author Community:

  • [ 1 ] [Wang X.]Institute of Laser Engineering, School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Wang X.]Beijing Engineering Research Center of 3D Printing for Digital Medical Health, Beijing, 100124, China
  • [ 3 ] [Zhang D.]Institute of Laser Engineering, School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Zhang D.]Beijing Engineering Research Center of 3D Printing for Digital Medical Health, Beijing, 100124, China
  • [ 5 ] [Li A.]School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China
  • [ 6 ] [Li T.]Institute of Laser Engineering, School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 7 ] [Li T.]Beijing Engineering Research Center of 3D Printing for Digital Medical Health, Beijing, 100124, China
  • [ 8 ] [Zhang W.]Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China
  • [ 9 ] [Zhang W.]Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing, 100083, China
  • [ 10 ] [Zhang W.]Key Laboratory for Advanced Materials Processing of Ministry of Education, University of Science and Technology Beijing, Beijing, 100083, China
  • [ 11 ] [Liu X.]Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China
  • [ 12 ] [Liu X.]Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing, 100083, China
  • [ 13 ] [Liu X.]Key Laboratory for Advanced Materials Processing of Ministry of Education, University of Science and Technology Beijing, Beijing, 100083, China

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Source :

Journal of Manufacturing Processes

ISSN: 1526-6125

Year: 2024

Volume: 118

Page: 261-268

6 . 2 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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