With　the　miniaturization　and　deep　integration　of　electronics,　the　challenges　associated　with　high-power　heat　dissipation　technology　have　increased.　Combining　the　features　of　jet　cooling　technology　and　microchannel　cooling　technology,　a　hybrid　two-layered　channel-jet　heat　sink　is　designed　for　general　consumer　CPUs.　The　heat　sink　performance　is　investigated　experimentally.　Since　the　CPU　generation　power　is　120　W,　the　heat　sink　can　control　the　CPU　excess　temperature　below　60　°C　with　an　air　volume　less　than　20　m3/h　and　a　pressure　drop　less　than　20　Pa.　The　different　geometric　parameters　of　the　heat　sink　are　numerically　calculated.　Increasing　the　channel　width　and　reducing　the　channel　height　and　slot　length　can　enhance　the　heat　transfer　but　also　increase　the　pressure　drop.　Orthogonal　tests　are　employed　to　optimize　the　design　by　evaluating　the　performance　of　various　heat　sink　structures.　The　performance　evaluation　criterion　(PEC)　is　selected　as　the　evaluation　index.　Under　standard　conditions　with　a　cross-sectional　airflow　velocity　of　1.5　m/s,　the　optimal　structure　is　a　2　mm　channel　width,　12　mm　channel　height　and　50　mm　slot　length.　©　2024　Elsevier　Masson　SAS