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Author:

Guo, Y.-E. (Guo, Y.-E..) | Shang, D.-G. (Shang, D.-G..) | Xue, L. (Xue, L..) | Yin, X. (Yin, X..) | Chen, C.-L. (Chen, C.-L..) | Li, D.-H. (Li, D.-H..)

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EI Scopus SCIE

Abstract:

The fatigue performance and microstructure of polycrystalline copper treated by one (UUV1), two (UUV2), three (UUV3) passes of unconstraint ultrasonic vibration (UUV) treatment were investigated in this paper. The surface roughness, fatigue life, microstructure, and plastic strain energy before and after UUV treatment were compared. The results revealed that the surface integrity of the sample for UUV treatment higher than that of the original sample, and the microscope observation found that the grain orientation, the dislocation density, the low angle grain boundaries, the plastic strain energy of the damaged sample restored to the original state to a great extent after UUV treatment. The fatigue crack initiation life increased by 3 times after UUV3 treatment. © 2024

Keyword:

Molecular dynamics simulation Fatigue life Unconstraint ultrasonic vibration LAGBs Plastic strain energy

Author Community:

  • [ 1 ] [Guo Y.-E.]Laboratory of Theoretical and Computational Nanoscience, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Chinese Academy of Sciences, Beijing, 100190, China
  • [ 2 ] [Guo Y.-E.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Shang D.-G.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Xue L.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Yin X.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [Chen C.-L.]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 7 ] [Li D.-H.]School of Electrical Engineering, Tiangong University, Tianjin, 300387, China

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Source :

International Journal of Fatigue

ISSN: 0142-1123

Year: 2024

Volume: 185

6 . 0 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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