2.5D　interposer　technology　has　gotten　a　lot　of　attention　as　a　viable　solution　to　high　IO　density,　cost,　and　performance　challenges.　The　thermal　management　of　through　glass　vias　(TGVs)　is　not　currently　being　studied　as　much　as　through　glass　vias　(TSV)　heat　dissipation　and　microfluidic　design.　In　this　paper,　a　creative　work　for　the　thermal　performance　of　the　memory　chips　based　on　2.5D　packaging　is　comprehensively　studied　to　investigate　the　heat　dissipation　of　the　package.　On　the　one　hand,　the　idea　of　integrating　TGV　copper　pillar　arrays　into　the　glass　substrate　is　studied　and　refined.　In　order　to　explore　the　effect　of　TGV　copper　pillars　for　evaluating　the　ability　of　dissipating　heat,　a　finite　element　model　(FEM)　based　on　CFD　theory　is　built.　According　to　the　results,　when　there　are　more　TGV　copper　arrays,　the　maximum　junction　temperature　steadily　decreases.　On　the　other　hand,　the　use　of　steady-state　heat　transfer　methods　for　detecting　the　package＇s　junction　temperature　and　the　execution　of　corresponding　control　tests.　The　experiments　indicated　that　the　maximum　junction　temperature　of　the　package　can　be　respectively　decreased　by　12%　and　51%　when　silicon-based　and　diamond-based　heat　sink　materials　are　selected.　©　2023　IEEE.