The　one-step　direct　laser　writing　process　has　been　an　efficient　strategy　for　constructing　flexible　metal　structures.　However,　the　effect　of　laser　wavelength　on　the　structuring　process　remains　unclear,　thus　restricting　the　universal　manufacturing　process　development.　In　this　work,　the　feasibility　of　one-step　writing　of　flexible　Cu　structures　with　different　wavelength　continuous　diode　lasers　has　been　verified.　Here,　photothermal　reactions　dominate　in　the　decomposition　of　the　reducing　agent　to　form　copper　structures.　Differences　in　the　wavelength　primarily　affect　the　photothermal　reaction　amplitude　for　structuring,　resulting　in　a　variation　in　the　formation　of　Cu　structures.　Under　our　processing　conditions,　the　photothermal　reaction　induced　by　532　nm　laser　is　higher　than　808　nm　laser,　a　higher　reduced-joining　degree　of　the　Cu　structure　can　be　achieved　by　532　nm　laser.　This　results　in　a　superior　conductivity,　adhesion,　and　bendability　of　Cu　structures　fabricated　by　532　nm　laser　than　that　of　808　nm　laser.　Furthermore,　strain　sensors　that　can　detect　different　bending　angles　and　bending　frequencies　have　been　fabricated　by　532　nm　laser-written　structures　to　demonstrate　their　practical　applications.