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Author:

Zheng, Sikang (Zheng, Sikang.) | Zhang, Bin (Zhang, Bin.) | Zhou, Zizhen (Zhou, Zizhen.) | Li, Ang (Li, Ang.) | Han, Guang (Han, Guang.) | Lu, Xu (Lu, Xu.) | Wang, Guoyu (Wang, Guoyu.) | Han, Xiaodong (Han, Xiaodong.) | Zhou, Xiaoyuan (Zhou, Xiaoyuan.)

Indexed by:

EI Scopus SCIE

Abstract:

In van der Waals (vdW) layered thermoelectric materials, stacking faults play a pivotal role in determining their physical and transport properties. However, the absence of effective methods to control these stacking faults has hindered the optimization of transport performance. Here, in situ mechanical transmission electron microscopy techniques are applied to a state-of-the-art vdW thermoelectric compound, SnSe, to manipulate the generation of stacking faults. A comprehensive analysis of the atomic structure of stacking faults is conducted, and energy barrier calculations reveal the slip pathways of interlayer slips inducing these stacking faults. Furthermore, first-principles calculations demonstrate that introducing stacking faults can enhance thermoelectric performance by promoting band convergence and facilitating charge transport. These results provide a comprehensive understanding of stacking faults and present distinctive opportunities for structure manipulation to enhance functional properties in vdW layered materials.

Keyword:

Author Community:

  • [ 1 ] [Zheng, Sikang]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 2 ] [Zhang, Bin]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 3 ] [Zhou, Zizhen]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 4 ] [Lu, Xu]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 5 ] [Zhou, Xiaoyuan]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 6 ] [Zheng, Sikang]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China
  • [ 7 ] [Zhang, Bin]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China
  • [ 8 ] [Zhou, Zizhen]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China
  • [ 9 ] [Lu, Xu]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China
  • [ 10 ] [Zhou, Xiaoyuan]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China
  • [ 11 ] [Zhang, Bin]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100024, Peoples R China
  • [ 12 ] [Li, Ang]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100024, Peoples R China
  • [ 13 ] [Han, Xiaodong]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100024, Peoples R China
  • [ 14 ] [Zhang, Bin]Chongqing Univ, Analyt & Testing Ctr, Chongqing 401331, Peoples R China
  • [ 15 ] [Zhou, Xiaoyuan]Chongqing Univ, Analyt & Testing Ctr, Chongqing 401331, Peoples R China
  • [ 16 ] [Han, Guang]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
  • [ 17 ] [Wang, Guoyu]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
  • [ 18 ] [Han, Xiaodong]Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China

Reprint Author's Address:

  • [Zhang, Bin]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China;;[Zhou, Zizhen]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China;;[Zhou, Xiaoyuan]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China;;[Zhang, Bin]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China;;[Zhou, Zizhen]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China;;[Zhou, Xiaoyuan]Chongqing Univ, Ctr Quantum Mat & Devices, Chongqing 401331, Peoples R China;;[Zhang, Bin]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100024, Peoples R China;;[Zhang, Bin]Chongqing Univ, Analyt & Testing Ctr, Chongqing 401331, Peoples R China;;[Zhou, Xiaoyuan]Chongqing Univ, Analyt & Testing Ctr, Chongqing 401331, Peoples R China;;

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Source :

APPLIED PHYSICS LETTERS

ISSN: 0003-6951

Year: 2024

Issue: 5

Volume: 125

4 . 0 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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