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Author:

Zhang, Yamin (Zhang, Yamin.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Zhu, Hui (Zhu, Hui.) | Gong, Xueqin (Gong, Xueqin.) | Deng, Bing (Deng, Bing.) | Ma, Lin (Ma, Lin.)

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EI Scopus CSCD

Abstract:

The effects of self-heating and traps on the drain current transient responses of AlGaN/GaN HEMTs are studied by 2D numerical simulation. The variation of the drain current simulated by the drain turn-on pulses has been analyzed. Our results show that temperature is the main factor for the drain current lag. The time that the drain current takes to reach a steady state depends on the thermal time constant, which is 80 μs in this case. The dynamics of the trapping of electron and channel electron density under drain turn-on pulse voltage are discussed in detail, which indicates that the accepter traps in the buffer are the major reason for the current collapse when the electric field significantly changes. The channel electron density has been shown to increase as the channel temperature rises. © 2014 Chinese Institute of Electronics.

Keyword:

High electron mobility transistors Carrier concentration Electron density measurement Gallium nitride Electric fields Transient analysis Drain current

Author Community:

  • [ 1 ] [Zhang, Yamin]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 2 ] [Feng, Shiwei]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 3 ] [Zhu, Hui]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 4 ] [Gong, Xueqin]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 5 ] [Deng, Bing]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
  • [ 6 ] [Ma, Lin]Institute of Semiconductor Device Reliability Physics, College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

Reprint Author's Address:

  • 冯士维

    [feng, shiwei]institute of semiconductor device reliability physics, college of electronic information and control engineering, beijing university of technology, beijing, china

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Source :

Journal of Semiconductors

ISSN: 1674-4926

Year: 2014

Issue: 10

Volume: 35

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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