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Author:

Pei, X. (Pei, X..) | Bao, L. (Bao, L..) | Fu, P. (Fu, P..) | Wu, B. (Wu, B..) | Xie, Y. (Xie, Y..)

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EI Scopus

Abstract:

We report an ultracompact wafer-level laser emission chip through the integration of metasurface with VCSEL for structured light generation. There are 67 light spots over 130°field of view in the far field. © 2024 IEEE.

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Author Community:

  • [ 1 ] [Pei X.]Beijing University of Technology, Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing, 100124, China
  • [ 2 ] [Bao L.]Beijing University of Technology, Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing, 100124, China
  • [ 3 ] [Fu P.]Beijing University of Technology, Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing, 100124, China
  • [ 4 ] [Wu B.]Beijing University of Technology, Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing, 100124, China
  • [ 5 ] [Xie Y.]Beijing University of Technology, Key Laboratory of Optoelectronics Technology, Ministry of Education, Beijing, 100124, China

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Year: 2024

Language: English

Cited Count:

WoS CC Cited Count:

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ESI Highly Cited Papers on the List: 0 Unfold All

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Chinese Cited Count:

30 Days PV: 8

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