In　this　paper,　the　texture　evolution　of　the　Ni-5%W　alloy　baseband　with　different　strain　variables　(epsilon(vM)　=　3.9,　4.9,　and　5.1)　during　rolling　and　annealing　was　studied　using　the　electron　back　scattering　diffraction　(EBSD)　technique.　The　results　indicate　that　after　high-temperature　annealing　at　1150　degrees　C,　all　three　strain　levels　of　the　alloy　substrates　can　achieve　a　strong　cubic　texture,　with　a　content　exceeding　99%　(＜10　degrees).　However,　the　texture　evolution　trajectory　is　significantly　influenced　by　the　strain　level.　When　the　content　of　cubic　texture　in　the　alloy　substrates　under　strain　levels　of　3.9　and　5.1　is　the　same,　significant　temperature　differences　exist.　Additionally,　the　different　strain　levels　result　in　varying　nucleation　rates　and　growth　rates　of　cubic　texture　in　the　Ni-5%W　alloy　substrates.　The　study　reveals　that　in　the　alloy　substrates　under　strain　levels　of　3.9　and　4.9,　recrystallized　cubic　grain　nuclei　grow　within　a　layered　structure,　resulting　in　larger　grain　sizes　and　lower　nucleation　rates.　In　contrast,　in　the　alloy　substrates　under　a　strain　level　of　5.1,　recrystallized　cubic　grain　nuclei　form　from　small　equiaxed　grains,　leading　to　higher　nucleation　rates　but　smaller　grain　sizes,　competing　with　random　orientations.　In　the　later　stages　of　nucleation,　recrystallized　grains　in　the　alloy　substrates　under　a　strain　level　of　5.1　exhibit　a　significant　size　advantage,　rapidly　growing　by　engulfing　randomly　oriented　grains.　Compared　to　the　alloy　substrates　with　lower　strain　levels,　the　recrystallized　cubic　grains　in　the　alloy　substrates　under　a　strain　level　of　5.1　have　higher　nucleation　rates　and　faster　growth　rates.