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Author:

Zhao, Yu-Feng (Zhao, Yu-Feng.) | Wang, Zhan-Xin (Wang, Zhan-Xin.) | Yang, Cheng-Peng (Yang, Cheng-Peng.) | Zhai, Ya-di (Zhai, Ya-di.) | Mao, Sheng-Cheng (Mao, Sheng-Cheng.) | Ma, Yan (Ma, Yan.) | Long, Hai-Bo (Long, Hai-Bo.) | Li, Ang (Li, Ang.) | Wang, Li-Hua (Wang, Li-Hua.) | Han, Xiao-Dong (Han, Xiao-Dong.)

Indexed by:

EI Scopus SCIE

Abstract:

Springback is one of the most interesting mechanical phenomena for bent metals after stress/strain release. Most previous studies investigate the springback behaviors of metals only with low bending angles; rarely do studies investigate these metals under large bending angles. Here, we investigated the springback behaviors of twin-structured Ni nanowires (NWs) at various bending angles through in-situ experiments and molecular dynamics (MD) simulations. We discovered that the springback angle and deformation mode of twin-structured Ni NWs can be divided into three stages, which have rarely been reported. The results revealed that, as the maximum bending angle increases, the plasticity of the NWs transfers from partial dislocations parallel to the twin boundaries (TBs) to extended and full dislocations on multiple slip systems, and then to grain boundary (GB) generation. Unlike previous studies which suggested that deformation-induced dislocations and GBs are irreversible, our results show that these defects are reversible upon unloading. The different recoverable abilities of these deformation-induced defects lead to a bending-angle-dependent springback phenomenon. © 2024 Elsevier B.V.

Keyword:

Nanowires Nickel Grain boundaries High resolution transmission electron microscopy

Author Community:

  • [ 1 ] [Zhao, Yu-Feng]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 2 ] [Wang, Zhan-Xin]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 3 ] [Yang, Cheng-Peng]Suzhou Institute of Nanotech and Nanobionics Chinese Academy of Science, Suzhou; 215123, China
  • [ 4 ] [Zhai, Ya-di]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 5 ] [Mao, Sheng-Cheng]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 6 ] [Ma, Yan]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 7 ] [Long, Hai-Bo]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 8 ] [Li, Ang]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 9 ] [Wang, Li-Hua]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 10 ] [Han, Xiao-Dong]College of Materials Science and Engineering, Beijing University of Technology, Beijing Key Lab of Microstructure and Property of Advanced Material, Beijing; 100124, China
  • [ 11 ] [Han, Xiao-Dong]Department of Materials Science and Engineering, Southern University of Science and Technology, Guangdong; 518055, China

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Source :

Journal of Alloys and Compounds

ISSN: 0925-8388

Year: 2025

Volume: 1010

6 . 2 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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