Deformation　twinning　serves　as　the　primary　mechanism　of　plasticity　in　body-centered　tetragonal　tin　(Sn),　a　matrix　component　of　most　electronic　interconnection　materials,　as　temperature　decreases.　The　formation　of　intragranular　twins　and　their　transmission　across　grain　boundaries　significantly　influence　the　deformation　behavior　and　susceptibility　to　brittle　fracture　for　Sn-based　alloys　under　cryogenic　conditions.　Here,　we　performed　statistical　analysis　on　a　large　data　set　of　Sn　grains　from　two　commonly　used　commercial　Sn-based　solder　alloys:　Sn-3.0%Ag-0.5%Cu　and　Sn-3.5%Ag,　through　uniaxial　tensile　experiments　at　cryogenic　temperatures　and　postmortem　electron　backscattered　diffraction　characterization.　The　results　indicate　that　Sn　grains　with　their　caxis　aligned　along　the　tensile　direction　exhibit　a　higher　likelihood　of　twin　occurrence.　Furthermore,　the　presence　of　neighboring　grains　that　have　already　activated　twins　also　plays　a　critical　role　in　the　generation　of　new　twins.　The　twin　transfer　across　grain　boundaries　is　contingent　upon　the　geometrical　alignment　of　twin　systems　in　adjacent　grains;　misalignment　can　lead　to　intergranular　brittle　fracture　at　cryogenic　temperatures.