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Author:

崔丽 (崔丽.) | 李京川 (李京川.) | 郭星晔 (郭星晔.) | 吴旭 (吴旭.) | 贺定勇 (贺定勇.) | 王灿 (王灿.) | 史振富 (史振富.)

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zhihuiya

Abstract:

一种激光粉末床熔融AlSi10Mg合金激光焊接头焊前热处理的方法,涉及金属材料热处理技术领域。其基于激光粉末床熔融技术将AlSi10Mg合金原材料粉末制成铝硅合金构件,所述热处理方法需样品置于真空条件下,热处理温度为300~500℃,保温时间为2h,随炉冷却。本发明既可以有效印制打印件焊接后接头的高气孔率问题,又可以大幅提高焊接头的塑性延伸率。

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Patent Info :

Type: 发明申请

Patent No.: CN202410231640.7

Filing Date: 2024-02-29

Publication Date: 2024-06-04

Pub. No.: CN118123049A

Applicants: 北京工业大学

Legal Status: 实质审查

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ESI Highly Cited Papers on the List: 0 Unfold All

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30 Days PV: 0

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