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Abstract:
一种激光粉末床熔融AlSi10Mg合金激光焊接头焊前热处理的方法,涉及金属材料热处理技术领域。其基于激光粉末床熔融技术将AlSi10Mg合金原材料粉末制成铝硅合金构件,所述热处理方法需样品置于真空条件下,热处理温度为300~500℃,保温时间为2h,随炉冷却。本发明既可以有效印制打印件焊接后接头的高气孔率问题,又可以大幅提高焊接头的塑性延伸率。
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Patent Info :
Type: 发明申请
Patent No.: CN202410231640.7
Filing Date: 2024-02-29
Publication Date: 2024-06-04
Pub. No.: CN118123049A
Applicants: 北京工业大学
Legal Status: 实质审查
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